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Global Info Research announces the release of the report “Global Flip Chip Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030” . This report provides a detailed overview of the market scenario, including a thorough analysis of the market size, sales quantity, average price, revenue, gross margin and market share.The report provides an in-depth analysis of the competitive landscape, manufacturer’s profiles,regional and national market dynamics, and the opportunities and challenge that the market may be exposed to in the near future. Global Flip Chip Bonder market research report is a comprehensive analysis of the current market trends, future prospects, and other pivotal factors that drive the market.

The global Flip Chip Bonder market size is expected to reach $ 323.2 million by 2030, rising at a market growth of 1.1% CAGR during the forecast period (2024-2030).
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
This report studies the global Flip Chip Bonder production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Flip Chip Bonder, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Flip Chip Bonder that contribute to its increasing demand across many markets.

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Market Segmentation
Flip Chip Bonder market is split by Type and by Application. For the period 2019-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
    Fully Automatic
    Semi-Automatic

Market segment by Application
    IDMs
    OSAT

Major players covered
    BESI
    ASMPT
    Shibaura
    Muehlbauer
    K&S
    Hamni
    AMICRA Microtechnologies
    SET
    Athlete FA

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Flip Chip Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Flip Chip Bonder, with price, sales, revenue and global market share of Flip Chip Bonder from 2019 to 2024.
Chapter 3, the Flip Chip Bonder competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Flip Chip Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Flip Chip Bonder market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Flip Chip Bonder.
Chapter 14 and 15, to describe Flip Chip Bonder sales channel, distributors, customers, research findings and conclusion.

Our Market Research Advantages：
Global Perspective: Our research team has a strong understanding of the  company in the global Flip Chip Bonder market.Which offers pragmatic data to the company.
Aim And Strategy: Accelerate your business integration, provide professional market strategic plans, and promote the rapid development of enterprises.
Innovative Analytics: We have the most comprehensive database of resources , provide the largest market segments and business information.

About Us:
Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provide market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.

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