Economía
Departamento
Interuniversity Microelectronics Centre
Lovaina, Bélgica
Publicaciones en colaboración con investigadores/as de Interuniversity Microelectronics Centre (1)
2025
- Optimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay Performance
2025 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC
