Advanced Packaging
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Common terms and phrases
achieved
adhesion
Advanced Packaging
alloy
AMMS
ANSYS
ANSYS Icepak
applications
assembly
Atotech
ball bonding
ball grid array
base materials
Beica
Bond Head
burn-in sockets
cleaning
components
copper
Corporation
cost
device
die-attach
dierent
Dow Corning
DRIE
electrical
Electronics
embedded
EMC3D
enhanced
equipment
feature
Figure
flip chip
flux
IC packages
improvement
industry
Innovations
interconnect
intermetallic
ip chip
laminate
layer
lead-free
leadframe
machine
manufacturing
memory
MEMS
Mentor Graphics
MEPTEC
metallization
mold compound
multi-chip
NuSil
oers
performance
Ph.D
provides
reflow
reliability
reow
reportedly
requirements
RSAI
SEMICON
semiconductor
Semiconductor Packages
Sensata Technologies
silicon
Singapore
socket housing
solder ball
Solder Paste
solder spheres
solutions
spread diameter
stack
standard
substrate
surface
SUSS MicroTec
Systems
Tech
Tegal
test and burn-in
thermal
thermal grease
tion
tool
Unisem
vias
wafer
wafer bumping
wafer-level
wire bond
µm nm