Advanced Packaging
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Common terms and phrases
2008 ADVANCED PACKAGING
3D packaging
applications
assembly
Asymtek
automated
automotive
back-end
base package
Bob Cameron
bond quality
challenges
chip design
circuit
circuitry
CleanRooms
co-design
components
ConFab
conference
Contact
contamination control
continue
cooling
Corporation
cost
customers
density
Die-Attach
drive
electrical
electronics
engineering
equipment
feedback
Figure
flexible
flip chip
heat
Henkel
IMEC
INDUSTRY FORECAST 2008
integrated
intelligent clothing
interconnect
interface
JAN PROVOOST
Kyzen
LAKE LAS VEGAS
layer
lead-free
Manami Konishi
mask aligners
material
MEDIA SPONSORS
MEMS
Mentor Graphics
mold
nology
optimization
package design
Peltier effect
performance
Ph.D
pin-out
PIQC box
pitch
probe cards
pull test
quality control
quality index
reliability
require
SEMICON
semiconductor
sensor
shear test
signal
silicon
solder bumps
stacked package
stretchable
substrate
suppliers
surface
tech
technol
ther
thermal CPBs
tion
tool
TSVs
Umicore
wafer bumping
wafer-level
Watlow’s
wire bond
www.apmag.com January/February 2008
XSiL