Advanced Packaging
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Common terms and phrases
3D integration
adhesive
Advanced Packaging
Advantest
alignment
AlSiC
applications
Bond Head
bumped wafers
bumping technologies
C4NP
cess
challenges
Cheongju
cleaning
coating
copper pillar
Corporation
cost
cure
density
deposited
devices
dicing tape
die-attach film
die-attach paste
DRIE
DUT BOARD
edge
Electronics
electroplated solder
electroplating
engineering
equipment
etch rate
FIGURE
flip chip
flip chip bumps
FOW film
gold bumping
heat
Henkel
higher
improved
industry
interconnect
interface
Kyocera
LAKE LAS VEGAS
laser dicing
layer
lead-free solders
lithography
Liuzhou
manager
manufacturing
MEMS
ment
metallization
method
Michael Todd
NuSil
optimize
performance
Ph.D
photore
photoresist
pitch
plasma
Reflow Ovens
reflow soldering
reliability
requirements
SEMICON China
semiconductor
senior
socket
solder bumping
stack
stacked-die
step
substrates
surface
temperature
thermal grease
thin silicon
throughput
tion
TSVs
Umicore
Wafer Bumping
wafer-level
WEBCASTS
Wire Bonder
wire bonding