Advanced Packaging
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Common terms and phrases
2007 ADVANCED PACKAGING
adhesion layer
alignment
Amkor
applications
areas
Asymtek
Automation
Ball Bond
Bond Head
Booth
burn-in operations
camera
chain bonding
chamber
chip/package
components
compressive
Contact
Corporation
cost
deposition
device
die-attach
dielectric
encapsulation
engineering
etch
eutectic
FIGURE
Film stress
FLIP CHIP
Global
heat
heatsink
I/O plan
IMAPS
increase
industry
integrated
interconnect
JEDEC
laser
lead-free
leakage
LED matrix
manufacturing
materials
Matrix LED
metal
methodology
Michael Todd
Micro
module
mold compound
molding process
nanotechnology
NuSil
October 2007 ADVANCED
optical inspection
optimized
Pac Tech
Paricon
perature
Ph.D
production
Randy Castillo
reflow
Reflow Ovens
reliability
requirements
Rogers
San Jose
sembly
Semiconductor
senior
silicon
SOIC
solder ball
solutions
stack
substrate
suppliers
Synergetix
temperature
tensile
Test Sockets
THERMAL MANAGEMENT
tion
TSMC
Umicore
Visit
wafer
wafer bumping
warpage
wire bond
Wire Bonder
www.apmag.com October 2007