Advanced Packaging

3D assemblies 3D integration 3D packaging airow alignment marks applications ball bond bonded wafer bonder Brewer Science buckled pillar connectors C4NP cap wafer cell company’s component cooling copper Corp cost customers data centers Delamination Demmin detect defects dierent DL Technology E-MAIL EDITORIAL electronic assemblies embedded energy environment equipment ermal etch lines Figure Flip Chip frit George Riley Hanau heat heatsink imaging IMEC IMEC’s increased indium innovations interconnection ip chip JEDEC machine manufacturing Marco Müller MEMS devices Mentor Graphics ments models module NuSil ONLINE particles PAUL MAGILL PCB design PennWell PETER SALMON Ph.D Photovoltaics probe card reduce Replisaurus Riley SALMON semiconductor signicant silicon solder ball solutions stud bumping substrate system design system-level Taiwan technolo temperature TEST SOCKETS ther thermal bumps thermal management thermal performance thermal simulation tion Umicore underfill wafer-level wire bond www.apmag.com