Advanced Packaging
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Common terms and phrases
3D assemblies
3D integration
3D packaging
airow
alignment marks
applications
ball bond
bonded wafer
bonder
Brewer Science
buckled pillar connectors
C4NP
cap wafer
cell
company’s
component
cooling
copper
Corp
cost
customers
data centers
Delamination
Demmin
detect defects
dierent
DL Technology
E-MAIL
EDITORIAL
electronic assemblies
embedded
energy
environment
equipment
ermal
etch lines
Figure
Flip Chip
frit
George Riley
Hanau
heat
heatsink
imaging
IMEC
IMEC’s
increased
indium
innovations
interconnection
ip chip
JEDEC
machine
manufacturing
Marco Müller
MEMS devices
Mentor Graphics
ments
models
module
NuSil
ONLINE
particles
PAUL MAGILL
PCB design
PennWell
PETER SALMON
Ph.D
Photovoltaics
probe card
reduce
Replisaurus
Riley
SALMON
semiconductor
signicant
silicon
solder ball
solutions
stud bumping
substrate
system design
system-level
Taiwan
technolo
temperature
TEST SOCKETS
ther
thermal bumps
thermal management
thermal performance
thermal simulation
tion
Umicore
underfill
wafer-level
wire bond
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