Ardentec Corporation (3264.TWO)

Ardentec Corporation engages in the provision of semiconductor testing solutions in memory, logic, and mixed-signal ICs to integrated device manufacturers, pure play wafer foundry companies, and fabless design companies in the United States, Taiwan, Singapore, Korea, China, Europe, and internationally. It offers testing services, which include engineering services before mass production, such as test engineering consultations and recommendations for design, test plan and test program development, new product introduction process, test program cross-platform conversion, remote tester usage, complete product characterization, and laser program development and analysis; and mass production engineering services, including suggestions and services of test time reduction, yield analysis and enhancement, laser repair yield analysis and improvement, timely retrieval of test data on secured Internet, test program management system, traceable test program management system, test data analysis and periodical report provision, and outlier management services, as well as stable testing services. The company also provides probe card design and consultant, outsourced manufacturing, maintenance and repair capability, and system tracking of usage and maintenance; wafer level chip scale packaging backend process services; and final test and wafer probing platforms. In addition, it offers certification, quality engineering analysis, and quality system and assurance structure services, as well as quality, information security, and hazardous substance free policy services. The company was founded in 1999 and is headquartered in Hsinchu City, Taiwan.