KLA Corporation (KLAC)
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Learn moreKey Executives
| Name | Title | Pay | Exercised | Year Born |
|---|---|---|---|---|
|
Mr. Richard P. Wallace
|
President, CEO & Executive Director | 6.48M | -- | 1960 |
|
Mr. Bren D. Higgins
|
Executive VP & CFO | 2.83M | -- | 1970 |
|
Ms. Mary Beth Wilkinson
|
Executive VP, Chief Legal Officer & Corporate Secretary | 1.37M | -- | 1973 |
|
Mr. Ahmad A. Khan
|
President of Semiconductor Products & Customers | 2.82M | -- | 1974 |
|
Mr. Brian W. Lorig
|
Executive Vice President of KLA Global Services | 1.79M | -- | 1974 |
|
Mr. Virendra A. Kirloskar
|
Senior VP & Chief Accounting Officer | 455.18k | 3.04k | 1963 |
|
Dr. Ben Bin-Ming Tsai
|
CTO & Executive VP of Corporate Alliances | 998.02k | -- | 1959 |
|
Mr. Kevin M. Kessel C.F.A.
|
Vice President of Investor Relations | -- | -- | -- |
|
Ms. Randi Polanich
|
Senior VP & Chief Communications Officer | -- | -- | -- |
|
Mr. John Van Camp
|
Executive VP & Chief Human Resources Officer | -- | -- | -- |
KLA Corporation
- Sector:
- Technology
- Industry: Semiconductor Equipment & Materials
- Full Time Employees:
- 17,000
Description
KLA Corporation, together with its subsidiaries, provides process control and process-enabling solutions for manufacturing wafers, reticles/masks, chemicals/materials, integrated circuits (ICs), packaged ICs, and printed circuit boards. It operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. The company offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; wafer inspection and metrology systems; semiconductor software solutions; KLA Pro systems; and specialty semiconductor manufacturing, benchtop metrology, surface characterization, material strength characterization, and electrical property measurement products. It also provides etch, plasma dicing, deposition and other wafer processing technologies and solutions; direct imaging, inspection, optical shaping, inkjet, and additive printing, as well as computer-aided manufacturing and engineering solutions; and components. In addition, the company offers service programs. It serves semiconductor, and semiconductor-related and electronic device manufacturers. The company operates in China, Taiwan, Korea, North America, Japan, Europe, Israel, and rest of Asia. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
Corporate Governance
Upcoming Events
January 28, 2027 at 8:00 PM UTC
KLA Corporation Earnings Date
Recent Events
September 1, 2026 at 12:00 AM UTC
Dividend Date
August 17, 2026 at 12:00 AM UTC
Ex-Dividend Date
May 26, 2026 at 12:00 AM UTC
SD: Specialized Disclosure Report filed pursuant to Section 1502 of the Dodd-Frank Wall Street Reform and Consumer Protection Act relating to the use of conflict minerals (Rule 13p-1)
